SHANGHAI, April 21st, 2026 —— CIC extends our warmest congratulations to SJ Semiconductor (Jiangyin) Corporation (688820. SH) on its successful listing on the science and technology innovation board of the ShangHai Stock Exchange (SSE) today.
SJSEMI: Global Leader in Wafer-Level Advanced Semiconductor Packaging & Testing
SJSEMI is a world-leading provider of integrated circuit wafer-level advanced packaging and testing services, focusing on R&D, manufacturing and commercialization of advanced packaging solutions.
Its core business covers three segments:
Middle-end silicon wafer processing
Wafer-level packaging
Chiplet multi-chip integrated packaging
The company delivers full‑cycle advanced packaging and testing solutions for high-performance chips such as GPU, CPU, and artificial intelligence chips, with applications in high-performance computing (HPC), artificial intelligence, data centers, autonomous driving and other core end markets.
Key Technical & Market Leadership
Middle-end silicon wafer processing: Among the first in Chinese mainland to mass-produce 12-inch bumping; the first in Chinese mainland to offer 14nm advanced-node bumping services.
Wafer-level packaging: Complete product portfolio including 12-inch Low-K WLCSP for advanced nodes and ultra-thin chip WLCSP.
Chiplet & multi-chip integration: One of only four companies worldwide with large-scale 2.5D packaging capabilities; the only enterprise in Chinese mainland with mass production capability for wafer-level 2.5D packaging. Its technology fully covers mainstream heterogeneous integration schemes including 2.5D and 3D IC, representing the most advanced level in Chinese mainland with no technological gap vs. global leaders.
SJ SEMI has established stable partnerships with world-leading chip designers including Qualcomm, and is deeply integrated into the core supply system of the global semiconductor industry chain.
IPO Highlights
IPO offering size: 255,466,162 shares
Offering price: RMB 19.68 per share
Total offering proceeds: Approximately RMB 5.028 billion — the largest A-share IPO by fundraising amount in 2026 to date
Post-IPO total share capital: 1,862,774,097 shares
Debut performance: Opened at RMB 99.72, up 406.71% from the offering price; intraday market cap exceeded RMB 180 billion.
Market Position (According to CIC)
As of year-end 2024: Largest 12-inch bumping capacity in Chinese mainland
2024: No.1 in Chinese mainland by revenue for 12-inch WLCSP, with ~31% market share
2024: No.1 in Chinese mainland by revenue for 2.5D packaging, with ~85% market share
About Advanced Semiconductor Packaging Industry
Advanced semiconductor packaging is a critical enabler for high-performance chips, supporting heterogeneous integration, higher computing density, lower power consumption and shorter interconnection. Driven by AI, HPC, automotive electronics and data centers, the global advanced packaging market is expanding rapidly, with wafer-level packaging, 2.5D/3D stacking and chiplet integration becoming mainstream technical directions.
As a seasoned Industry Consultant, CIC offers services such as market sizing, competitive analysis, and enterprise value verification, etc., with global experience in advising "first-in-sector" IPOs in the Advanced packaging and semiconductor sectors.
From IPO preparation to listing hearings, CIC unearths the true intrinsic value of enterprises and translates it into actionable insights for successful capital market landing. Prior to SJSemi, CIC has supported leading enterprises in successful listings both domestically and overseas, including MiniMax, Biren Technology, Horizon Robotics and Baidu, etc.
CIC Reports are now available on Bloomberg and FactSet portals.
About CIC
CIC is a professional consulting firm offering tailored end-to-end support across the full investment and financing lifecycle. The firm boasts a world-leading track record in guiding landmark first-in-sector IPOs across global markets, alongside unrivaled reach and in-depth coverage capabilities across specialized niche market segments.
CIC helps enterprises refine scalable business models and craft compelling capital narratives to enable seamless access to global capital markets, while serving as a trusted due diligence partner to investment institutions. It delivers granular industry insights and direct access to subject matter experts, empowering clients to identify high-value opportunities and mitigate critical risks effectively.
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